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| ESD5Z2.5T1 SERIES Transient Voltage Suppressors Micro-Packaged Diodes for ESD Protection The ESD5Z Series is designed to protect voltage sensitive components from ESD and transient voltage events. Excellent clamping capability, low leakage, and fast response time, make these parts ideal for ESD protection on designs where board space is at a premium. Because of its small size, it is suited for use in cellular phones, portable devices, digital cameras, power supplies and many other portable applications. Specification Features: http://onsemi.com 1 Cathode 2 Anode * Small Body Outline Dimensions: * * * * * * * * 0.047 x 0.032 (1.20 mm x 0.80 mm) Low Body Height: 0.028 (0.7 mm) Stand-off Voltage: 2.5 V - 7.0 V Peak Power up to 200 Watts @ 8 x 20 ms Pulse Low Leakage Response Time is Typically < 1 ns ESD Rating of Class 3 (> 16 kV) per Human Body Model IEC61000-4-2 Level 4 ESD Protection IEC61000-4-4 Level 4 EFT Protection 2 1 SOD-523 CASE 502 PLASTIC MARKING DIAGRAM XXd 1 2 Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic Epoxy Meets UL 94 V-0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260C XX = Specific Device Code d = Date Code Device Meets MSL 1 Requirements MAXIMUM RATINGS Rating IEC 61000-4-2 (ESD) IEC 61000-4-4 (EFT) ESD Voltage Per Human Body Model Per Machine Model PD TJ, Tstg TL Air Contact Symbol Value 30 30 40 16 400 100 -55 to +150 260 Unit kV A kV V mW C C ORDERING INFORMATION Device ESD5ZxxxT1 Package SOD-523 Shipping 3000/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Total Power Dissipation on FR-5 Board (Note 1) @ TA = 25C Junction and Storage Temperature Range Lead Solder Temperature - Maximum (10 Second Duration) DEVICE MARKING INFORMATION See specific marking information in the device marking column of the Electrical Characteristics tables starting on page 2 of this data sheet. Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. FR-5 = 1.0 x 0.75 x 0.62 in. (c) Semiconductor Components Industries, LLC, 2004 1 November, 2004 - Rev. 0 Publication Order Number: ESD5Z2.5T1/D ESD5Z2.5T1 SERIES ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Symbol IPP VC VRWM IR VBR IT IF VF Ppk C Parameter Maximum Reverse Peak Pulse Current Clamping Voltage @ IPP Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT Test Current Forward Current Forward Voltage @ IF Peak Power Dissipation Max. Capacitance @VR = 0 and f = 1 MHz IPP VC VBR VRWM IR VF IT V IF I Uni-Directional TVS ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types) VRWM (V) Max 2.5 3.3 5.0 6.0 7.0 IR (mA) @ VRWM Max 6.0 0.05 0.05 0.01 0.01 VBR (V) @ IT (Note 2) Min 4.0 5.0 6.2 6.8 7.5 IT mA 1.0 1.0 1.0 1.0 1.0 VC (V) @ IPP = 5.0 A* Typ 6.5 8.4 11.6 12.4 13.5 VC (V) @ Max IPP* Max 10.9 14.1 18.6 20.5 22.7 IPP (A)* Max 11.0 11.2 9.4 8.8 8.8 Ppk (W)* Max 120 158 174 181 200 C (pF) Typ 145 105 80 70 65 Device** ESD5Z2.5T1 ESD5Z3.3T1 ESD5Z5.0T1 ESD5Z6.0T1 ESD5Z7.0T1 Device Marking ZD ZE ZF ZG ZH **Other voltages available upon request. *Surge current waveform per Figure 1. 2. VBR is measured with a pulse test current IT at an ambient temperature of 25C. 100 % OF PEAK PULSE CURRENT 90 80 70 60 50 40 30 20 10 0 0 20 40 t, TIME (ms) 60 80 tP tr PEAK VALUE IRSM @ 8 ms PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms HALF VALUE IRSM/2 @ 20 ms Figure 1. 8 x 20 ms Pulse Waveform http://onsemi.com 2 ESD5Z2.5T1 SERIES PACKAGE DIMENSIONS SOD-523 CASE 502-01 ISSUE A -X- A -Y- B 1 D 2 PL 0.08 (0.003) M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. DIM A B C D J K S MILLIMETERS MIN NOM MAX 1.10 1.20 1.30 0.70 0.80 0.90 0.50 0.60 0.70 0.25 0.30 0.35 0.07 0.14 0.20 0.15 0.20 0.25 1.50 1.60 1.70 MIN 0.043 0.028 0.020 0.010 0.0028 0.006 0.059 INCHES NOM 0.047 0.032 0.024 0.012 0.0055 0.008 0.063 MAX 0.051 0.035 0.028 0.014 0.0079 0.010 0.067 2 TXY C K J S -T- SEATING PLANE SOLDERING FOOTPRINT 1.40 0.0547 0.40 0.0157 0.40 0.0157 SCALE 10:1 mm inches http://onsemi.com 3 ESD5Z2.5T1 SERIES ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 4 ESD5Z2.5T1/D |
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